Surface Mount Device Package Types

Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame.

Surface mount device package types.

A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case. Micro surface mount device extended technology. Bump chip carrier bga. Surface mount device or smd is the term used for the electronic components used within the surface mount assembly process.

The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices. Bumpered quad flat pack cabga ssbga. Ceramic land grid array see lga cpga. Ceramic flat pack clga.

It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. The small outline integrated circuit soic plastic package is shown above. A very large number of different types of package exist. Chip array small scale ball grid array cbga.

Surface mount device package types soic package. Ceramic ball grid array cfp. As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases. There is a wide range of smd component packages available on the market and come in many shapes and sizes a selection can be seen below.

Ceramic pin grid array cpga graphic cqfp. Sot 223 small outline transistor.