Fewer holes need to be drilled.
Surface mount device advantages.
Surface mount technology smt is a method in which the electrical components are mounted directly onto the surface of a printed circuit board pcb.
Smd components are 60 80 smaller in size than their thru hole counterparts.
Advantages and issues charles l.
Surface mount technology smt is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards pcbs.
Introduction minimizing the size of electronic components so that more functions can be achieved in a given volume has been a way of life since the early days of large vacuum tubes.
Hutchins texas instruments incorporated stafford texas usa 1.
2 much higher component density components per unit area and many more connections per component.
When you subject components to mechanical stress it is not reliable to use surface mounting as the sole method of attachment to the pcb.
The process was standard practice until the rise of surface mount technology smt in the 1980s at which time it was expected to completely phase out through hole.
This means devices can be designed to be more lightweight and compact.
Advantages of surface mount technology.
Therefore they occupy lesser space on the smt pcb thus making it smaller and slimmer.
Weight of these components is also much less.
Since smd components are mounted or soldered directly on the surface of the board surface mount technology.
Smaller and slim pcb.
The advantages of surface mount technology.
These devices are known as smds or surface mount devices.
Disadvantages of surface mount technology.
These advantages have ensured that smt has dominated the pcb world since its conception.
An electronic device so made is called a surface mount device smd.
4 simpler and faster automated assembly.
Even though smt has several advantages the technology to surface mount a device also brings with it certain disadvantages.
Surface mount technology smt permits the creation of smaller pcb designs by allowing components to be placed closer together on the board.
3 lower initial cost and time of setting up for production.